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Semiconductor IC Packaging Materials Market Size, Share, and Industry Analysis By Type (Organic substrate, Bonding wires, Lead frames, Encapsulation resins, Ceramic packages, Die Attach materials, Thermal interface materials, and Others), By Packaging Technology (Wire bonding, Flip-Chip packaging, Wafer-level packaging (WLP), System-in-package (Sip), and Others), By End-use Industry (Aerospace & Defense, Automotive, Consumer electronics, Healthcare, I

Last Updated: 31 March 2025
Base Year: 2024
Historical Data: 2020-2023
No of Pages: 94
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